IC晶片邦定機控制系統(tǒng)設(shè)計（本科畢業(yè)論文）

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中文摘要

現(xiàn)在，在多數(shù)的電子設(shè)備中都會用到晶片。晶片是實集成電路等電子器件中不可缺少的部件。邦定機是封裝行業(yè)中很重要的設(shè)備
集成電路（IC）產(chǎn)業(yè)已成為國民經(jīng)濟發(fā)展的關(guān)鍵，而IC 設(shè)計、制造和封裝測試是IC 產(chǎn)業(yè)發(fā)展的三大產(chǎn)業(yè)之柱。我國IC封裝業(yè)一直是IC產(chǎn)業(yè)鏈中的第一支柱產(chǎn)業(yè)。據(jù)統(tǒng)計，2007年國內(nèi)集成電路封裝測試業(yè)共實現(xiàn)銷售收入627.7億元，同比增長26.4%，繼續(xù)保持了快速發(fā)展勢頭 。但是，我國主要是在低端方面，而在新技術(shù)發(fā)面，我們遠遠落后在國外同行業(yè)后面。
邦定機是封裝行業(yè)中很重要的設(shè)備，我們本次的設(shè)計雖然不能改變什么，但我們可以從中了解我國的概況，引起我們的重視，從而迎頭趕上國外。此次設(shè)計是學生設(shè)計，我們可以從中學到很多：對綜合知識的應用，掌握機電系統(tǒng)典型零件的計算方法及正確的結(jié)構(gòu)設(shè)計方法，樹立我們獨立的設(shè)計思想，培養(yǎng)我們分析問題的能力，對資料的收集，對問題的發(fā)現(xiàn)與解決，對新設(shè)計的設(shè)計步驟等等。
在這過程中，我們主要通過查資料，參考現(xiàn)成的產(chǎn)品等方法去完成此次設(shè)計。
設(shè)計出的邦定機在很大程度上是不完善的，相對于參考的AB520邦定機，在體型，功能等方面都有很大的不足，這主要是受限于知識與經(jīng)驗等方面的原因。但是我相信這會是一次很好的鍛煉機會
 
關(guān)鍵詞：IC晶片，邦定機，控制系統(tǒng)

ABSTRACT

Now, in most electronic equipment will be used in the chip. IC chips are electronic devices is an indispensable component. Bonding machine industry is a very important package of equipment
Integrated circuit (IC) industry has become the key to national economic development, IC design, manufacturing and IC packaging and testing industry is the development of the three major industries of the column. China's IC packaging industry has been linked in the IC industry is the first pillar industries. According to statistics, in 2007 the domestic IC packaging and testing industry realized a total sales income of 62.77 billion yuan, an increase of 26.4 percent, continuing to maintain a momentum of rapid development. China, however, mainly in the low-end, while the new technology Famian, we lag far behind foreign countries in the same industry behind.
Bonding machine industry is a very important package of equipment, the design of this we can not change what, but we can learn from China's profile has aroused our attention, to catch up with foreign countries. The design students design, we can learn a lot from: comprehensive knowledge of the application of mechanical and electrical systems have typical components of the calculation method and correct the structural design methods, establish our independent design ideas, nurture our ability to analyze problems, Data collection, the problem discovered and resolved, the design of the new design steps, and so on.
In this process, we mainly through investigations, information and off-the-shelf products, such as methods to complete the design.
The state will design a machine to a large extent be imperfect. Compared to the reference AB520 bonding machine, the size, functions and other aspects of the great shortage, which is mainly limited knowledge and experience in the areas of reasons. However, I believe it would be a good training opportunity

Key words: IC chip， bonding machine, control system