單晶硅微米壓痕過程的有限元分析（本科畢業(yè)論文設(shè)計）

摘 要

隨著微、納米科技的蓬勃發(fā)展，微、納米級材料在電子信息、生物工程、醫(yī)學(xué)、醫(yī)藥、航空航天、國防等高新尖端領(lǐng)域得到了市場化的應(yīng)用。因此人布門越來越多的關(guān)注材料在微、納米尺度下的特性。通過壓頭對材料表面加載，然后測出壓痕區(qū)域，以此來評價材料機械性能這項技術(shù)，我們稱之為壓痕技術(shù)。由于超薄層(一些涂層及復(fù)合材料界面層等)的厚度達到亞微米級甚至納米級，傳統(tǒng)的壓痕方法己經(jīng)不適用。一種嶄新的材料測試技術(shù)—微、納米壓痕技術(shù)應(yīng)運而生。
本文是采用Marc軟件模擬了微、納米壓痕儀的加載過程，三維有限元模型考慮了微米壓痕儀的標準球形壓頭。介紹了有限元模型的幾何參數(shù)、邊界條件、材料特性與加載過程，討論了系列載荷下球形壓頭有限元仿真后的載荷—壓入深度的分析、彈塑性分析球形壓頭典型載荷有限元仿真結(jié)果分析以及試件模型的大小對計算結(jié)果的影響。在此基礎(chǔ)上，重點討論壓頭的材料壓痕載荷—位移曲線，分析單晶硅材料的彈塑性性能。展望未來，對本課題提出的問題可以通過軟件實現(xiàn)自動優(yōu)化，以得到材料的彈塑性性能。無疑這將為單晶硅的廣泛應(yīng)用奠定堅實的基礎(chǔ)，在促進電子信息發(fā)展也有很大的作用。

關(guān)鍵詞：微米壓痕試驗，彈塑性接觸，單晶硅，有限元分析

ABSTRACT

With the booming of Micro/Nanotechnology, the applications of micro/nano-scale materials are mainly industry of Electronic Engineering, Biologic Engineering, Medicine Science and Aerospace. Therefore, people pay more and more attentions to the macro/nano-scale materials. However, the traditional method of testing materials is not applicable to these materials. A novel mether—micro/nanoindentation was proposed, which is a new technology to measure materialties. The displacement of the indenter (0.1~l00nm) is monitored and recorded during the experiments.Therefore, a relationship between load and displacemt is obtained after the experiments, which can be used to analyze the elastic properties of the material.
This paper is a software simulation of the micro-Marc, Nanoindentation for the loading process, 3-D finite element model to consider a micron indentation for the standard spherical pressure head. Introduced a finite element model of geometric parameters, boundary conditions, material properties and the loading process, to discuss a series of load spherical pressure head FEM after the load - the pressure to the depth of analysis, elastic-plastic spherical pressure head of a typical load finite element The simulation results and analysis of the sample size model of the impact of the results. On this basis, the discussion focused on the pressure head of indentation load - displacement curve, the analysis of the silicon material Elastoplastic performance. Looking to the future, subject to the questions raised by software for automatic optimization, in order to get the elastic-plastic material properties. No doubt this will be the wider use of monocrystalline silicon and lay a solid foundation in promoting the development of electronic information have great role to play.

Key words： Micro-indentation, Elastic-plastic contact, Monocrystal silicon, Finite element analysis


目 錄

摘要 I
ABSTRACT II
1 緒論 1
1.1 課題的目的及意義 1
1.2 國內(nèi)外的研究現(xiàn)狀 2
1.2.1 微米壓痕技術(shù)的理論與實驗研究 2
1.2.3 彈塑性接觸力學(xué)問題的理論研究 4
1.3 課題任務(wù)、重點研究內(nèi)容、實現(xiàn)途徑 5
1.3.1 課題任務(wù) 5
1.3.2 主要研究內(nèi)容與實現(xiàn)途徑 5
2 微米壓痕實驗與接觸力學(xué)分析 7
2.1微米壓痕實驗 7
2.2 接觸力學(xué)模型 9
2.2.1 Hertz接觸模型 9
2.2.2彈塑性接觸模型 9
2.2.3 屈服準則 10
3 有限元方法及Marc軟件的簡介 14
3.1 有限元方法 14
3.1.1 有限元方法概述 14
3.1.2 有限元方法的求解 15
3.2 MSC.Marc軟件介紹 18
3.2.1 Marc的主要模塊與分析流程 18
3.2.2 Marc的接觸分析功能 20
4 單晶硅微米壓痕實驗的有限元分析 21
4.1 建立有限元模型 21
4.2 計算結(jié)果分析 24
4.2.1 彈性接觸分析 24
4.2.2 彈塑性接觸分析 26
4.2.3 彈性與彈塑性接觸行為的比較 30
4.3 結(jié)論 33
致謝 35
參考文獻 36